Handbook of Ceramic Grinding and Polishing
Focusing on the machining of ceramic materials such as silicon nitride, silicon carbide, and zirconia, this handbook meets the growing need in industry for a clear understanding of modern improvements in ceramic processing. The presentation is international in scope, with techniques and information represented from the USA, Japan, Germany, and the United Kingdomùcountries that have made important contributions to the field. The 20 expert chapter authors explore the challenge of reducing the costs of machining operations, a continuing problem in an industry where ceramic parts must be machined into final form to achieve a proper fit.
The handbook reveals that the abrasive machining of ceramic materials will always be a requirement because of the difficulty of controlling parts dimensions at the high temperatures required in their creation. The contributors then explain the properties and characteristics of ceramics, the various types of abrasive processes, and typical tests used in the procedures. An entire section of the handbook concerns grinding tools, their conditioning, lubrication, and cooling, checking for wear on the tools, and using them efficiently. The book also examines modern honing and superfinishing tools and machines, and describes advances in the technology, as well as lapping and polishing techniques using chemical compounds and ultrasound.
Ceramics is a field where more advanced products are sure to appear. Many of the products will require advanced, better-controlled processing technologies; vastly improved productivity in manufacturing; and increased product reliability. The contributors to this Handbook will assist readers in the attainment of these important goals.
Отзывы - Написать отзыв
Не удалось найти ни одного отзыва.
Properties of Ceramics
Deformation and Fracture of Ceramics Materials
Не показаны другие разделы: 6
abrasive grains accuracy alumina application axial behavior bond boron carbide brittle fracture brittle materials carbide ceramic materials ceramics characteristics chemical chip clamping device colloidal silica components cooling lubricant crack cutting edges defects depth of cut diameter diamond grain diamond wheels dressing ductile effect elastic energy feed flaws fracture toughness friction geometrical grain boundaries grinding force grinding machine grinding of ceramics grinding process grinding wheel grit hardness honing stones increase indentation influence layer load manufacturing material removal rate matrix measuring mechanical mechano-chemical polishing metal microcracks microstructure normal forces oxide parameters particles phase plastic deformation polishing method powder pressure process chain production properties radial residual stresses rotation shown in Figure shows silicon nitride sintering slurry specific spindle stiffness stock removal strength structure subsurface surface grinding surface integrity surface quality surface roughness temperature tensile stresses thermal conductivity tool tribological ultrasonic valves wafer wheel wear workpiece